Semi-aqueous solvent based method of cleaning rosin flux residue

A semi-aqueous solvent based method using non-aromatic halogen-free organic solvent compositions for the effective removal of flux residue from electronic component surfaces after high temperature solder interconnections in the presence of rosin based flux compositions. Rosin flux residue can be removed using hydrophobic essentially water insoluble propylene glycol alkylether solvents in conjunction with a surfactant preferably an ionic and/or a mixture of a non-ionic and an ionic surfactant in the first step then a second step involving immersion with agitation in a hydrophobic solvent with no added surfactant. This is followed by a third step of hydrophilic solvent immersion with agitation/spray rinsing off the hydrophilic solvent with water and then a drying step.