A packaging system for a component is disclosed. The packaging system comprises a box and a compressible and shock-absorbent packing insert. The packing insert is placed in the box after nesting a component within the insert. The insert comprises a main panel a first end tube hingedly coupled to the main panel a second end tube hingedly coupled to the main panel opposite the first end tube a first side tube hingedly coupled to the main panel the first side tube being adjacent to the first end tube and a second side tube hingedly coupled to the main panel the second side tube being adjacent to the second end tube and opposite the first side tube wherein the first and second side tube panels and the first and second side tube panels may include at one or more cutouts to enhance the flexing capability of the packing insert. Accordingly the packing insert in accordance with the present invention employs low cost environment friendly material to protect fragile components from any potential damage that can be caused during the shipping process.