This specific technology provides a device which comprises a unique 'nanoplasmonic layer' having a heating side and a cooling side. This nanoplasmonic device also comprises a cooling structure adjacent to the cooling side of the 'layer'. The 'cooling structure' of this emerging technology formed from a dielectric or a semiconductor with embedded nanoparticles that support surface Plasmon or phonon resonance. The localization of these cooling structures is engineered for rapid cooling and focused cooling effects-minimizing any heating related performance loss in real life applications. The overall design of this novel device enables to remove heat from the layer effectively in a compact manner.
With this specific technology we offer a novel nanoplasmonic device with nanoscale cooling affect providing satisfactory cooling in an efficient and compact manner.