Metal-Carbon Nanotube Composites for Enhanced Thermal Conductivity for Demanding or Critical Applications

This technology provides a carbon nanotube composite matrix which improves thermal conductivity and heat dissipation compared to existing commercially available material. Carbon nanotubes can be organized in a random or specific alignment to fit the needs of the application. Because the melting point of carbon nanotubes (> 2000F) far exceeds traditional metals the composite provides a material that can withstand higher temperatures is able to conduct heat at an accelerated rate. Applications: 1) IC (integrated circuit) boards 2) Electronic circuits 3) Aerospace and automotive industries 4) Metal forging 5) Building materials 6) Nuclear and standard power plant equipment


1) Increased heat tolerance 2) Increased thermal conduction/heat dissipation

Date of release