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Composition for photoimaging

An improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts by weight per 100 parts of resin system of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of a difunctional epoxy resin. The photosensitive cationically polymerizable epoxy based system is especially useful as a solder mask and does not contain bromine.

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