Electronics generate heat when they are used. In order to function properly they need to be cooled down. The more efficiently electronics can transfer this heat to another source the more energy it can use. Cold plates can be used to transfer heat more efficiently from electronics to the air or from electronics to some kind of liquid. As high-powered electronics continue to push power density limits engineers are attempting to find ways to cool these high-powered electronics more efficiently. Current research at ASU has developed technology that is designed to solve the problem of Fin Efficiency for cooling electronic components. Traditional cold plates typically use cross flow plate design to disperse heat. This cross flow plate design is limited in heat exchange due to Fin Efficiency. Fin Efficiency results from the finite thermal conductivity of the fin. The tip of the fin has a lower temperature than the base which limits its performance. The new technology developed by ASU changes the flow path direction from across the fin to along the fin from tip to base. This allows for a drastic increase in heat transfer area and eliminates the problem of Fin Efficiency. Potential Applications: •Servers •Semiconductors •Defense •Renewable Energy •Medical Equipment •Lasers •Power Electronics
•Increase in the Heat Transfer Area – 23.5 times the heat transfer area per square inch of the footprint. •Increase in Heat Capture – when compared to a current commercial cold plate testing shows a 70% increase in heat capture. •Higher Efficiency – by changing the flow path from across the fin to along the fin from tip to base.