Cleaning method to remove flux residue in electronic assembly

This invention provides a method for removing flux residue and similar other residues formed on the surfaces of micro electronic components during soldering operations using solder paste and fluxing agents in electronic module assembly component fabrication by a semi-aqueous solvent cleaning process using propylene glycol alkyl ether solvents preferably the mono alkyl ethers as replacements for xylene. The electronic components may contain plastic components for example a plastic grid array (PBGA) in addition to silicon device chip(s) C4 decaps and SMTs on a ceramic chip carrier with solder columns. Preferred solvents are dipropylene glycol mono methyl ether and tripropylene glycol mono methyl ether which are both water soluble.